شاید برای شما هم پیش آمده باشد گاهی در زمینه الکترونیک و قطعات SMD به نام و اصطلاحی بر خورده باشید که معنا و مفهوم آن را ندانید در اینجا ما به شرح بیشتر این اصطلاحات و معرفی برخی از پکیج های پر کاربرد قطعات SMD می پردازیم .
ابتدا اصطلاحات مهم :
SMD Surface Mounted Devices
(active, passive and electromechanical components)
SMT Surface Mounted Technology
(assembling and montage technology)
SMA Surface Mounted Technology
(module assembled with SMT)
SMD / C Surface Mounted Devices / Components
(components for SMT)
SMP Surface Mounted Packages
(SMD case forms)
SME Surface Mounted Equipment
(SMT assembling machines)
SO Small Outline
(4 to 28 pins)
VSO Very Small Outline
(40 pins)
SOP Small Outline Package
(case)
SOD Small Outline Diode
SOT Small Outline Transistor
SOIC Small Outline Integrated Circuit
CC Chip Carrier
LCC Leadless Chip Carrier
MELF Metal Electrode Face Bonding
MINI MELF Mini Metal Electrode Face Bonding
MICRO MELF Micro Metal Electrode Face Bonding
اما در خصوص پکیج قطعات SMD :
برای کاربردهای معمولی
BCC: Bump Chip Carrier
BGA: Ball Grid Array; BGA graphic
BQFP: Bumpered Quad Flat Pack
CABGA/SSBGA: Chip Array/Small Scale Ball Grid Array
CBGA: Ceramic Ball Grid Array
CCGA: Ceramic Column Grid Array
CFP: Ceramic Flat Pack
CGA: Column Grid Array
CPGA: Ceramic Pin Grid Array
CQFP: Ceramic Quad Flat Pack
CSBGA: Cavity Down BGA
CSP BGA: Chip Scale Package BGA
TBD: Ceramic Lead-Less Chip Carrier
DFN: Dual Flat Pack, No Lead
DLCC: Dual Lead-Less Chip Carrier (Ceramic) DLCC Graphic
ETQFP: Extra Thin Quad Flat Package
FBGA: Fine-pitch Ball Grid Array
FCBGA: Flipchip BGA
FPGA: Fine Pitch Ball Grid Array
HSBGA: Heat Slug Ball Grid Array
JDIP: J-Leaded Dual In-Line J-Lead DIP Picture
JLCC: J-Leaded Chip Carrier (Ceramic) J-Lead Picture
LBGA: Low Profile Ball Grid Array
LCC: Leaded Chip Carrier LCC Graphic
LCC: Leaded Chip Carrier Un-formed LCC Graphic
LCCC: Leaded Ceramic Chip Carrier;
LFBGA: Low-Profile, Fine-Pitch Ball Grid Array
LGA: Land Grid Array LGA Graphic [Pins located on Mother board, not the device]
LLCC: Leadless Chip Carrier LLCC Graphic
LQFP: Low-profile Quad Flat pack
MCMBGA: Multi Chip Module Ball Grid Array
MCMCABGA: Multi Chip Module-Chip Array Ball Grid Array
MLCC: Micro Leadframe Chip Carrier
MLP: Micro Lead-frame Package
MQFP: Metric Quad Flat Pack
OBGA: Organic Ball Grid Array
PBGA: Plastic Ball Grid Array, BGA graphic
PLCC: Plastic Leaded Chip Carrier
PQFD: Plastic Quad Flat
PQFP: Plastic Quad Flat Pack
PSOP: Plastic Small-Outline Package PSOP graphic
QFN: Quad Flat No-Lead
QFP: Quad Flat pack QFP Graphics
QSOP: Quarter Size Outline Package
SBGA: Super BGA - above 500 Pin count
SOIC: Small Outline IC
SOJ: Small-Outline Package [J-Lead]
SOLIC: Small Outline Large Integrated Circuit (Gull-Wing Lead Wide Body)
SSOP: Shrink Small-Outline Package
TBGA: Thin Ball Grid Array
TFBGA: Thin profile Fine-pitch Ball Grid Array
TQFP: Thin Quad Flat Pack TQFP Graphic
TSOP: Thin Small-Outline Package
TSSOP: Thin Shrink Small-Outline Package
TVSOP: Thin Very Small-Outline Package
UFBGA: Ultra FineLine BGA
VQFB: Very-thin Quad Flat Pack
برای کاربردهای نظامی:
MIL-STD-1835C - Electronic Component Case Outlines
MIL-HDBL-6100 - List of Case Outlines and Dimensions for Discrete Semiconductor Devices
MIL-M-55565C - Microcircuits, Packaging of
MIL-STD-1285C - Marking of Electrical and Electronic Parts
JEITA ED-7303C, Name and code for integrated circuit packages Japan Electronics and Information Technology Industries Association (JEITA).
حالا که انواع اصطلاحات در این زمینه را بررسی کردیم به معرفی بعضی از پکیج های پر کاربرد قطعات SMD می پردازیم :
برای مقاومت های SMD :
